Committees
• DATE 2018 Executive Committee  |
• DATE 2018 Sponsors Committee |
| • Technical Programme Topic Chairs |
• TPC Members |
| • Reviewers |
|
| Technical Programme Topic Chairs 2018 |
| Track D | Design Methods and Tools |
| Track Chair | Ayse Coskun, Boston University, US |
| D1 System Specification and Modeling | D2 System Design, High-Level Synthesis, and Optimization | D3 System Simulation and Validation | |
| Chair: Ingo Sander, KTH Royal Institute of Technology, SE Co-Chair: Andreas Gerstlauer, University of Texas at Austin, US |
Chair: Yuko Hara-Azumi, Tokyo Institute of Technology, JP Co-Chair: Philippe Coussy, Universite de Bretagne-Sud / Lab-STICC, FR |
Chair: Valeria Bertacco, University of Michigan, US Co-Chair: Graziano Pravadelli, University of Verona, IT |
|
| D4 Formal Methods and System Verification | DT5 Design and Test for Analog and Mixed-Signal Circuits and Systems, and MEMS | DT6 Design and Test of Secure Systems | |
| Chair: Christoph Scholl, University of Freiburg, DE Co-Chair: Armin Biere, Johannes-Kepler-University Linz, AT |
Chair: André Ivanov, University of British Columbia, CA Co-Chair: Georges Gielen, Katholieke Universiteit Leuven, BE |
Chair: Ilia Polian, University of Stuttgart, DE Co-Chair:Lejla Batina, Radboud University Nijmegen, NL |
|
| D7 Network on Chip | D8 Architectural and Microarchitectural Design | D9 Power Modeling, Low-Power Design, and Power-Aware Optimization | |
| Chair: Luca Carloni, Columbia, US Co-Chair: Sebastien Le Beux, Lyon Institute of Nanotechnology, FR |
Chair: Eli Bozorgzadeh, Univ. of California, Irvine, US Co-Chair: Francisco Cazorla, Barcelona Supercomputing Center and IIIA-CSIC, ES |
Chair: Alberto Macii, Politecnico di Torino, IT Co-Chair: Naehyuck Chang, KAIST, KR |
|
| D10 Temperature and Variability-Aware System Design and Optimization | D11 Reconfigurable Computing | D12 Logical and Physical Analysis and Design | |
| Chair: Giovanni Ansaloni, USI - Lugano, CH Co-Chair: Jose L. Ayala, Complutense University of Madrid, ES |
Chair: Fabrizio Ferrandi, Politecnico di Milano, IT Co-Chair: Florent de Dinechin, INSA-Lyon, FR |
Chair: Tiziano Villa, Dipartimento d'Informatica, Universita' di Verona, IT Co-Chair: Elena Dubrova, Royal Institute of Technology - KTH, SE |
|
| D13 Emerging Technologies for Future Computing | D14 Emerging Technologies for Future Memories | ||
| Chair: Aida Todri-Sanial, CNRS-LIRMM/University of Montpellier, FR Co-Chair: Walter Weber, NaMLab gGmbH and CfAED, DE |
Chair: Jean-Michel Portal, Aix-Marseille University, FR Co-Chair: Pierre-Emmanuel Gaillardon, University of Utah, US |
| Track A | Application Design |
| Track Chair | Ian O’Connor, Lyon Institute of Nanotechnology, FR |
| A1 Power-efficient and Sustainable Computing | A2 Communication, Consumer and Multimedia Systems | A3 Automotive Systems and Smart Energy Systems |
| Chair: Muhammad Shafique, Vienna University of Technology (TU Wien), AT Co-Chair: Baris Aksanli, San Diego State University, US |
Chair: Steffen Paul, University Bremen, DE Co-Chair: Theocharis Theocharides, University of Cyprus, CY |
Chair: Davide Brunelli, University of Trento, IT Co-Chair: Sebastian Steinhorst, Technical University of Munich, DE |
| A4 Healthcare, Wellness, and Assistive Technologies | A5 Secure Systems, Circuits, and Architectures | A6 Reconfigurable and Robust Systems |
| Chair: Elisabetta Farella, Fondazione Bruno Kessler (FBK), IT Co-Chair: Joaquín Recas, Computer Science Faculty, Complutense University of Madrid, ES |
Chair: Tim Güneysu, University of Bremen & DFKI, DE, Co-Chair: Stefan Mangard, Graz University of Technology, AT |
Chair: Christian Weis, University of Kaiserslautern, DE Co-Chair: Antonio Miele, Politecnico di Milano, IT |
| A7 Applications of Emerging Technologies | A8 Industrial Experiences Brief Papers | |
| Chair: Andy Tyrrell, University of York, GB Co-Chair: Yu Wang, Tsinghua University Beijing, CN |
Chair: Fabien Clermidy, CEA-Leti, FR Co-Chair: Norbert Wehn, University of Kaiserslautern, DE |
| Track T | Test and Robustness |
| Track Chair | Cristiana Bolchini, Politecnico di Milano, IT |
| T1 Modeling and Mitigation of Defects, Faults, Variability, and Reliability | T2 Test Generation, Simulation and Diagnosis | T3 Design-for-Test, Test Infrastructures, Test Standards |
| Chair: Mehdi Tahoori, Karlsruhe Institute of Technology, DE Co-Chair: Said Hamdioui, Delft University of Technology, NL |
Chair: Matteo Sonza Reorda, Politecnico di Torino - DAUIN, IT Co-Chair: Davide Appello, STMicroelectronics, IT |
Chair: Sybille Hellebrand, University of Paderborn, DE Co-Chair: Jerzy Tyszer, Poznan University of Technology, PL |
| T4 System-Level Reliability Design, Analysis and On-line Test | DT5 Design and Test for Analog and Mixed-Signal Circuits and Systems, and MEMS | DT6 Design and Test of Secure Systems |
| Chair: Jaume Abella, Barcelona Supercomputing Center (BSC-CNS), ES Co-Chair: Maria K. Michael, University of Cyprus, CY |
Chair: André Ivanov, University of British Columbia, CA Co-Chair: Georges Gielen, Katholieke Universiteit Leuven, BE |
Chair: Ilia Polian, University of Stuttgart, DE Co-Chair: Lejla Batina, Radboud University Nijmegen, NL |
| Track E | Embedded and Cyber-physical Systems |
| Track Chair | Franco Fummi, Universita′ di Verona, IT |
| E1 Real-time, Networked, and Dependable Systems | E2 Compilers and Software Synthesis | E3 Model-based Design and Verification |
| Chair: Kai Lampka, Electrobit Automotive GmbH, DE Co-Chair: Dionisio de Niz, Carnegie Mellon University, US |
Chair: Frank Hannig, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE Co-Chair: Bjorn De Sutter, Ghent University, BE |
Chair: Petru Eles, Linköping University, SE Co-Chair: Borzoo Bonakdarpour, University of Waterloo, CA |
| E4 Embedded Software Architectures | E5 Software architectures for Cyber-Physical Systems | |
| Chair: Akash Kumar, Technische Universitaet Dresden, DE Co-Chair: Orlando Moreira, Intel Corporation, PT |
Chair: Shiyan Hu, Michigan Technological University, US Co-Chair: Thomas Nolte, Control, SE |
| TPC Members |
Jaume Abella, Barcelona Supercomputing Center (BSC-CNS), ES
Jung Ho Ahn, Seoul National University, KR
Baris Aksanli, San Diego State University, US
Mohammad Al Faruque, University of California Irvine, US
Armin Alaghi, University of Washington, US
Sebastian Altmeyer, University of Amsterdam, NL
Luca Amaru, Synopsys, US
Paolo Amato, Micron, IT
Baghdadi Amer, Institut Mines-Telecom; Telecom Bretagne; CNRS
Lab-STICC, FR
Amir Aminifar, Swiss Federal Institute of Technology in Lausanne (EPFL), CH
Lorena Anghel, Grenoble-Alpes University, FR
Giovanni Ansaloni, USI - Lugano, CH
Davide Appello, STMicroelectronics, IT
Todd Austin, University of Michigan, US
Jose L. Ayala, Complutense University of Madrid, ES
Aydin Aysu, University of Texas at Austin, US
Nadine Azemard, LIRMM, FR
Patricia Balbastre, Universtat Politecnica de Valencia, ES
Manuel Barragan, TIMA Laboratory, FR
Andrea Bartolini, University of Bologna, IT
Lejla Batina, Radboud University Nijmegen, NL
Lars Bauer, Karlsruhe Institute of Technology, DE
Luca Benini, Università di Bologna, IT
Mladen Berekovic, TU Braunschweig, DE
Anna Bernasconi, Universita' di Pisa, IT
Valeria Bertacco, University of Michigan, US
Michal Bidlo, Brno University of Technology, CZ
Armin Biere, Johannes Kepler University Linz, AT
Roderick Bloem, Graz University of TEchnology, AT
Michaela Blott, Xilinx, IE
Nicola Bombieri, University of Verona, IT
Borzoo Bonakdarpour, University of Waterloo, CA
Guillermo Botella, Complutense University of Madrid, ES
Christos Bouganis, Imperial College London, GB
Marc Boyer, ONERA, FR
Eli Bozorgzadeh, Univ. of California, Irvine, US
Florian Brandner, Télécom ParisTech, FR
Luca Breveglieri, Politecnico di Milano, IT
Oliver Bringmann, University of Tuebingen / FZI, DE
Philip Brisk, University of California, Riverside, US
Philip Brisk, University of California, Riverside, US
Davide Brunelli, University of Trento, IT
Wayne Burleson, U Massachusetts Amherst, US
Gianpiero Cabodi, Politecnico di Torino, IT
Andrea Calimera, Politecnico di Torino, IT
Ramon Canal, Universitat Politècnica de Catalunya, ES
Luca Carloni, Columbia University, US
Luigi Carro, UFRGS, BR
Jeronimo Castrillon, TU Dresden, DE
Francisco Cazorla, Barcelona Supercomputing Center and IIIA-CSIC, ES
Vikas Chandra, ARM, US
Naehyuck Chang, KAIST, KR
Anupam Chattopadhyay, Nanyang Technological University, SG
Sudipta Chattopadhyay, Singapore University of Technology and Design (SUTD), SG
Yuanqing Cheng, Beihang University, CN
Kiyoung Choi, Seoul National University, KR
Jungwook Choi, IBM T. J. Watson Research Center, US
Alessandro Cilardo, University of Naples Federico II, IT
Alessandro Cimatti, Fondazione Bruno Kessler, IT
Fabien Clermidy, CEA-LETI, FR
Philippe Coussy, Universite de Bretagne-Sud / Lab-STICC, FR
Masoud Daneshtalab, KTH Royal Institute of Technology, SE
Jean Luc Danger, Télécom ParisTech, FR
Luca Daniel, M.I.T., US
Anup Das, Imec, NL
Reetuparna Das, Michigan, US
Florent de Dinechin, INSA-Lyon, FR
Dionisio de Niz, Carnegie Mellon University, US
Flavio M. de Paula, IBM Corporation, US
Bjorn De Sutter, Ghent University, BE
Giuseppe Desoli, STMicroelectronics, IT
Stefano Di Carlo, Politecnico di Torino, IT
Mario Diaz Nava, STMicroelectronics, FR
Christian Drewes, Intel, DE
Elena Dubrova, Royal Institute of Technology - KTH, SE
Stephan Eggersglüß, Mentor Graphics, DE
Petru Eles, Linkoping University, SE
Rolf Ernst, TU Braunschweig, DE
Suhaib A. Fahmy, University of Warwick, GB
Yliès Falcone, Univ. Grenoble Alpes, Inria, FR
Zhenman Fang, UCLA/Xilinx, US
Luca Fanucci, University of Pisa, IT
Elisabetta Farella, Fondazione Bruno Kessler (FBK), IT
Christian Fayomi, Printable Smart Devices Lab/UQAM, CA
Francisco V. Fernandez, IMSE-CNM, CSIC and Univ. Sevilla, ES
Fabrizio Ferrandi, Politecnico di Milano, IT
Wieland Fischer, Infineon Technologies, DE
Gerhard Fohler, Technische Universität Kaiserlautern, DE
william fornaciari, Politecnico di Milano - DEIB, IT
Aurélien Francillon, EURECOM, FR
Pierre-Emmanuel Gaillardon, University of Utah, US
Marc Geilen, Eindhoven University of Technology, NL
Andreas Gerstlauer, The University of Texas at Austin, US
Georges Gielen, KU Leuven, BE
Bastien Giraud, CEA LETI, FR
Tony Givargis, University of California, Irvine, US
Emil Gizdarski, Synopsys, US
Michael Glaß, Ulm University, DE
Elena Gnani, University of Bologna, IT
Diana Goehringer, TU Dresden, DE
Dip Goswami, Eindhoven University of Technology, NL
Mariagrazia Graziano, Politecnico di Torino, IT
Patrick Groeneveld, DAC, US
Daniel Grosse, University of Bremen/DFKI, DE
radu grosu, Vienna University of Technology, AT
Jorge Guajardo, Bosch Research and Technology Center, Robert Bosch LLC, US
Tim Güneysu, University of Bremen & DFKI, DE
Frank Gurkaynak, ETH Zurich, CH
Soonhoi Ha, Seoul National University, KR
Said Hamdioui, Delft University of Technology, NL
Jie Han, University of Alberta, CA
Frank Hannig, Friedrich-Alexander University Erlangen-Nürnberg, DE
Yuko Hara-Azumi, Tokyo Institute of Technology, JP
Jim Harkin, Ulster University, GB
Paul Havinga, University of Twente, NL
Arne Heittman, RWTH Aachen University, DE
Sybille Hellebrand, University of Paderborn, DE
Deukhyoun Heo, Washington State University, US
Marc Heyns, IMEC, BE
Tsung-Yi Ho, National Tsing Hua University, TW
Houman Homayoun, George Mason University, US
Nuno Horta, Instituto de Telecomunicações/Instituto Superior Técnico, PT
Shiyan Hu, Michigan Technological University, US
Yu Hua, Huazhong University of Science and Technology, CN
Michael Huebner, Ruhr-University Bochum, DE
Mike Hutter, Cryptography Research Inc., US
Leandro Indrusiak, University of York, GB
Andrè Ivanov, University of British Columbia, CA
Ravi Iyer, Intel, US
Axel Jantsch, TU Wien, AT
Maksim Jenihhin, Tallinn University of Technology, EE
Li Jiang, Department of Computer Science and Engineering, Shanghai
Jiao Tong University, CN
Ajay Joshi, Boston University, US
Lei Ju, Shandong University, CN
Maria K. Michael, University of Cyprus, CY
Kyungsu Kang, Samsung, KR
Georgios Karakonstantis, Queen's University Belfast, GB
Ryan Kastner, UCSD, US
Paul Kaufmann, University of Paderborn, DE
Doris Keitel-Schulz, Infineon AG, DE
Georgios Keramidas, Think Silicon S.A./Technological Educational
Institute of Western Greece, GR
Samira Khan, University of Virginia, US
Saman Kiamehr, Bosch Starter Generator GmbH, DE
Hyoseung Kim, University of California, Riverside, US
John Kim, KAIST, KR
Jae-Joon Kim, Pohang University of Science and Techology, KR
Dirk Koch, University of Manchester, GB
Farinaz Koushanfar, University of California San Diego, US
Tushar Krishna, Georgia Institute of Technology, US
Daniel Kroening, University of Oxford, GB
Bram Kruseman, NXP Semiconductors, NL
Dhireesha Kudithipudi, Rochester Institute of Technology, US
Akash Kumar, Technische Universitaet Dresden, DE
Eren Kursun, IEEE, US
Shahar Kvatinsky, Technion, IL
Kai Lampka, Electrobit Automotive GmbH, DE
Luca Larcher, Università di Modena e Reggio Emilia, IT
Erik Larsson, Lund University, SE
Luciano Lavagno, Politecnico di Torino, IT
Sébastien Le Beux, Lyon Institute of Nanotechnology, FR
Gildas Leger, Instituto de Microelectronica de Sevilla, IMSE-CNM,
(CSIC - Universidad de Sevilla), ES
Romain Lemaire, CEA-Leti, FR
Florian Letombe, Synopsys, FR
Bing Li, TU München (TUM), DE
Hai (Helen) Li, Duke University/TUM-IAS, US
Huawei Li, Institute of Computing Technology, Chinese Academy of
Sciences, CN
Mark Po-Hung Lin, National Chung Cheng University, TW
yongpan liu, tsinghua university, CN
Marie-Minerve Louerat, CNRS and University Pierre et Marie Curie, FR
Mohamed M. Sabry, Nanyang Technological University, SG
Alberto Macii, Politecnico di Torino, IT
Enrico Macii, Politecnico di Torino, IT
Roel Maes, Intrinsic-ID, NL
Michele Magno, ETH Zurich, CH
Yiorgos Makris, The University of Texas at Dallas, US
Frederic Mallet, Univ. Nice Sophia Antipolis, FR
Stefan Mangard, Graz University of Technology, AT
Hans Manhaeve, Ridgetop Europe, BE
Florence Maraninchi, Univ. Grenoble-Alpes & Verimag, FR
Igor L. Markov, University of Michigan, US
Andrea Marongiu, ETH Zurich, CH
Emil Matus, Technische Universität Dresden, DE
Dorin Maxim, University of Lorraine - Loria - Inria Nancy Grand Est, FR
Teresa McLaurin, ARM, US
Marcel Medwed, NXP Semiconductors Austria GmbH, AT
Pascal Meinerzhagen, Intel Circuit Research Lab, US
Gokhan Memik, Northwestern University, US
Nele Mentens, KU Leuven, BE
Brett Meyer, McGill University, CA
Antonio Miele, Politecnico di Milano, IT
Shahriar Mirabbasi, University of British Columbia, CA
Subhasish Mitra, Stanford University, US
Anca Molnos, CEA-LETI, Grenoble, FR
Jose Monteiro, INESC-ID, Técnico, U Lisboa, PT
Fernando Moraes, PUCRS University, BR
Orlando Moreira, Intel Corporation, PT
Katell Morin-Allory, TIMA Laboratory, FR
Grzegorz Mrugalski, Mentor Graphics, PL
Saibal Mukhopadhyay, Georgia Institute of Technology, US
Rajeev Murgai, Synopsys India Pvt. Ltd., IN
Hiroshi Nakamura, The University of TOKYO, JP
Alberto Nannarelli, Technical University, DK
Gabriela Nicolescu, Ecole Polytechnique de Montréal, CA
Dimitris Nikolos, University of Patras, GR
Thomas Nolte, MRTC/Mälardalen University, SE
David Novo, French National Centre for Scientific Research (CNRS), FR
Umit Ogras, Arizona State University, US
David Oswald, School of Computer Science, University of Birmingham, GB
Gianluca Palermo, Politecnico di Milano, IT
Ioannis Papaefstathiou, Technical university of Crete, GR
Bogdan Pasca, Intel, FR
Sudeep Pasricha, Colorado State University, US
Steffen Paul, University Bremen, DE
Vasilis Pavlidis, University of Manchester, GB
Li-Shiuan Peh, Professor, National University of Singapore, SG
Laurence Pierre, Univ. Grenoble Alpes, TIMA Lab., FR
Christian Pilato, Università della Svizzera italiana, CH
Jose Pineda, NXP Semiconductors, NL
Marco Platzner, University of Paderborn, DE
Thomas Poeppelmann, Infineon Technologies AG, DE
Ilia Polian, University of Stuttgart, DE
Florian Pölzlbauer, Virtual Vehicle, AT
Massimo Poncino, Politecnico di Torino, IT
Jean-Michel Portal, Aix-Marseille University, FR
Laura Pozzi, USI Lugano, CH
Graziano Pravadelli, University of Verona, IT
Mihalis Psarakis, University of Piraeus, GR
Qinru Qiu, Syracuse University, US
Davide Quaglia, University of Verona, IT
Martin Radetzki, University of Stuttgart, DE
Amir M. Rahmani, University of California Irvine & TU Wien, US
Jaan Raik, Tallinn university of Technology, EE
Wenjing Rao, University of Illinois at Chicago, US
Sandip Ray, NXP Semiconductors, US
Arijit Raychowdhury, Georgia Institute of Technology, US
Joaquín Recas, Computer Science Faculty, Complutense University of Madrid, ES
Francesco Regazzoni, ALaRI, CH
Semeen Rehman, TU Wien, AT
Salvatore Rinaudo, STMicroelectronics, IT
Tanguy Risset, Inria/INSA-Lyon, FR
Rosa Rodríguez-Montañés, UPC, ES
Tajana Rosing, UCSD, US
Kristin Yvonne Rozier, NASA Ames Research Center, US
Roxana Rusitoru, ARM Ltd., GB
Manoj Sachdev, University of Waterloo, CA
Kazuo Sakiyama, The University of Electro-Communications, JP
Ingo Sander, KTH Royal Institute of Technology, SE
Toshinori Sato, Fukuoka University, JP
Matthias Sauer, University of Freiburg, DE
Julien Schmaltz, Eindhoven University of Technology, NL
Christoph Scholl, University Freiburg, DE
Daniel Schostak, ARM Ltd, GB
Donatella Sciuto, Politecnico di Milano, IT
Lukas Sekanina, Brno University of Technology, CZ
Shreyas Sen, ECE, Purdue University, US
Olivier Sentieys, INRIA, FR
Johanna Sepulveda, TU Munich, DE
Muhammad Shafique, Vienna University of Technology (TU Wien), AT
Zili Shao, Hong Kong Polytechnic University, HK
Farhana Sheikh, Intel Corporation, US
Donghwa Shin, Department of Computer Engineering, Yeungnam
University, KR
Aviral Shrivastava, Arizona State University, US
Max Shulaker, MIT, US
Amit Kumar Singh, University of Essex, GB
Sergei Skorobogatov, University of Cambridge, GB
Stefan Slesazeck, NaMLab gGmbH, DE
Frank Slomka, Ulm University, DE
Hayden So, University of Hong Kong, HK
Mathias Soeken, EPFL, CH
Matteo Sonza Reorda, Politecnico di Torino - DAUIN, IT
Todor Stefanov, Leiden University, NL
Sebastian Steinhorst, Technical University of Munich, DE
Andreas Steininger, Vienna University of Technology, AT
Daryl Stewart, ARM, GB
Dominik Stoffel, TU Kaiserslautern, DE
Sander Stuijk, Eindhoven University of Technology, NL
Mehdi Tahoori, Karlsruhe Institute of Technology, DE
Sheldon Tan, University of California at Riverside, US
Jürgen Teich, University of Erlangen-Nuremberg, DE
Vasileios Tenentes, ARM Cambridge, GB
Mark M. Teranipoor, University of Florida, US
Theocharis Theocharides, University of Cyprus, CY
Lothar Thiele, ETH Zurich, CH
Aida Todri-Sanial, CNRS-LIRMM/University of Montpellier, FR
Hiroyuki Tomiyama, Ritsumeikan University, JP
Lionel Torres, University of Montpellier, FR
Martin Albrecht Trefzer, University of York, GB
Antonino Tumeo, Pacific Northwest National Laboratory, US
Andy Tyrrell, University of York, GB
Jerzy Tyszer, Poznan University of Technology, PL
Alexandre Valentian, CEA LETI, FR
Rene van Leuken, Delft University of Technology, NL
Gerd Vandersteen, Vrije Universiteit Brussel - dept. ELEC, BE
Shobha Vasudevan, UIUC, US
Elena Ioana Vatajelu, TIMA, FR
Ingrid Verbauwhede, KU Leuven - COSIC, BE
Naveen Verma, Princeton University, US
Bart Vermeulen, NXP Semiconductors, NL
Tiziano Villa, Dipartimento d'Informatica, Universita' di Verona, IT
Sara Vinco, Politecnico di Torino, IT
Arnaud Virazel, LIRMM, FR
Pascal Vivet, CEA-LETI, FR
Li-C. Wang, UCSB, US
Yu Wang, Tsinghua University, CN
Yanzhi Wang, University of Southern California, US
Walter Weber, NaMLab gGmbH and CfAED, DE
Pieter Weckx, IMEC, BE
Norbert Wehn, University of Kaiserslautern, DE
Christian Weis, University of Kaiserslautern, DE
Robert Wille, Johannes Kepler University Linz, AT
Christoph M. Wintersteiger, Microsoft Research, GB
Marc Witteman, Riscure, NL
Hans-Joachim Wunderlich, University of Stuttgart, DE
Jiang Xu, Hong Kong University of Science and Technology, HK
jason xue, City University of Hong Kong, HK
Jingling Xue, UNSW, AU
Sotirios Xydis, National Technical University of Athens, GR
Chengmo Yang, University of Delaware, US
Chia-Lin Yang, National Taiwan University, TW
Hailong Yao, Tsinghua University, CN
Shusuke Yoshimoto, Osaka University, JP
Hao Yu, Nanyang Technological University, SG
Wenjian Yu, Tsinghua University, CN
Haibo Zeng, Virginia Tech, US
Weisheng Zhao, Beihang University, CN
Qi Zhu, University of California, Riverside, US
Dirk Ziegenbein, Robert Bosch GmbH, DE
Daniel Ziener, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE
Davide Zoni, Politecnico di Milano, IT
| Reviewers |
|
Ahmad Razavi |
Kamyar Mirzazad Barijough |