Date: Thursday 21 March 2013
Time: 14:00 - 15:30
Location / Room: Chartreuse

Chair:
Frank Oppenheimer, OFFIS, DE

Co-Chair:
François Pêcheux, UPMC, FR

Physical properties have a great impact on the robustness and predictable behaviour of complex micro-electronic systems, and therefore should be considered at system-level. The first paper addresses power and thermal management at the transaction level, while the last two papers present innovative analysis techniques to increase system reliability.

Time	Label	Presentation Title Authors
14:00	11.4.1	SYSTEM-LEVEL MODELING OF ENERGY IN TLM FOR EARLY VALIDATION OF POWER AND THERMAL MANAGEMENT Authors: Tayeb Bouhadiba1, Matthieu Moy2 and Florence Maraninchi2 1Verimag/CNRS, FR; 2Verimag/Grenoble INP, FR Abstract
14:30	11.4.2	SYSTEM-LEVEL MODELING AND MICROPROCESSOR RELIABILITY ANALYSIS FOR BACKEND WEAROUT MECHANISMS Authors: Chang-Chih Chen and Linda Milor, Georgia Institute of Technology, US Abstract
15:00	11.4.3	AUTOMATIC SUCCESS TREE-BASED RELIABILITY ANALYSIS FOR THE CONSIDERATION OF TRANSIENT AND PERMANENT FAULTS Authors: Hananeh Aliee, Michael Glaß, Felix Reimann and Jürgen Teich, University of Erlangen-Nuremberg, DE Abstract
15:30	IP5-16, 574	HYBRID PROTOTYPING OF MULTICORE EMBEDDED SYSTEMS Authors: Ehsan Saboori and Samar Abdi, Concordia University, CA Abstract
15:30		End of session Coffee Break in Exhibition Hall Monday and Friday morning and afternoon coffee breaks will be located in the Salle de Reception. On Tuesday-Thursday the breaks will be located in the Exhibition Hall. Morning and afternoon (with the exception of Thursday afternoon which is a 30 minute break) coffee breaks on Tuesday-Thursday are extended breaks and will run for 60 minutes (coffee points will be open for the first 30 minutes only) from the start time indicated in the programme.