Understanding Chiplets Today to Anticipate Future Integration Opportunities and Limits
Gabriel H. Loh1, Samuel Naffziger2 and Kevin Lepak3
1Advanced Micro Devices, Inc. Bellevue, WA, USA
gabriel.loh@amd.com
2Advanced Micro Devices, Inc. Fort Collins, CO, USA
samuel.naffziger@amd.com
3Advanced Micro Devices, Inc. Austin, TX, USA
kevin.lepak@amd.com
ABSTRACT
Chiplet-based architectures have recently started attracting a lot of attention, and we are seeing real-world architectures utilizing chiplet technologies in high-volume commercial production in multiple mainstream markets. In this special session paper, we provide a technical overview of the current state of chiplet technology including its benefits and limitations. This provides background and grounding in the current state-of-the-art and also lays out a range of technical areas to consider for the remaining forward-looking papers in this special session. We discuss the benefits and costs of different approaches to splitting and modularizing a monolithic chip into chiplets. In particular, we cover supporting high bandwidth and low latency communication between the die, mixed integration of multiple process technology nodes, and silicon and IP reuse. We then explore future challenges for chiplet architectures looking into the next decade of innovation.
Keywords: Chiplets, Integration, Process Technology.
