Device- and Temperature Dependency of Systematic Fault Injection Results in Artix-7 and iCE40 FPGAs
Christian Fibich1,a, Martin Horauer1,b and Roman Obermaisser2
1Dept. of Electronic Engineering University of Applied Sciences Technikum Wien Vienna, Austria
afibich@technikum-wien.at
bhorauer@technikum-wien.at
2Chair for Embedded Systems University of Siegen Siegen, Germany
roman.obermaisser@uni-siegen.de
ABSTRACT
Systematic fault injection into the configuration memory of SRAM-based FPGAs promises to gain insight into the criticality of individual configuration bits. Current approaches implicitly assume that results obtained on one FPGA device can be generalized to all devices of that type and hence allow to parallelize fault injection. This work, to the best of our knowledge, is the first to challenge this assumption. To that end, a synthetic test design was subjected to systematic fault injection on 16 Xilinx Artix-7 as well as 10 Lattice iCE40 FPGAs for which bitstream documentation is publicly available. The results of these experiments indicate that the derived sets of critical configuration bits vary from device to device of the same type, especially if the interconnect is targeted. Furthermore, temperature is observed to influence the fault injection results on Artix-7. Suggestions for dealing with the implications in future fault injection experiments are provided.
Keywords: FPGA, Fault Injection, Device Variations.
