Pre-Assembly Testing of Interconnects in Embedded Multi-Die Interconnect Bridge (EMIB) Dies
Sudipta Mondal and Krishnendu Chakrabarty
Duke University, Durham, USA
ABSTRACT
The embedded multi-die interconnect bridge (EMIB) is an advanced packaging technology for 2.5D integration. This paper presents a bridge test architecture based on the proposed IEEE Std. P1838. The proposed test method enables access to interconnects at a pre-assembly stage by pairing the interconnects using metal shorts and probing on coarse-pitch C4 bumps. It can efficiently detect resistive-open and resistive-short defects in the bridge interconnects and micro-bumps. Simulation results are presented to evaluate the range of defects that can be detected by the proposed method.
