10.8 EDA+3D+MEMS Innovation Agenda 2020 Fueling the Innovation Chain of Electronics

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Date: Thursday 27 March 2014
Time: 11:00 - 12:30
Location / Room: Exhibition Theatre

Organiser:
J├╝rgen Haase, edacentrum, DE

Moderator:
Ahmed Jerraya, CEA-LETI, FR

Panelists:
Gabriel Kittler, X-FAB, DE
Brandon Wang, Cadence, US
Brent Gregory, Synopsys, US
Horst Symanzik, Bosch-Sensortec GmbH, DE
Gerd Teepe, GLOBALFOUNDRIES, DE

Today the most powerful innovations in the major industries and the most promising approaches to tackle burning societal challenges are substantially influenced by and depending from the innovations provided by the microelectronics industry. Breakthroughs in manufacturing technologies enable the realization of novel types of devices and of systems, which enable applications with fascinating functionality and enormous performance. However, this innovation chain is not operational without appropriate innovations in design technology: We need an innovation Agenda 2020 for design methodology and EDA tools fueling the innovation chain of electronics. 2014 the technologies for MEMS and for 3D chips have reached a maturity level that enables them to reshape our lives until 2020. This panel will discuss how to utilize these technologies: Which applications will become possible with the upcoming innovations in 3D and MEMS technologies, what kind of EDA innovations will be required in order to be able to implement these applications effectively and efficiently, yielding powerful yet reliable components and systems. The set-up of the panel includes the manufacturers GLOBALFOUNDRIES and X-FAB, Bosch as leading supplier of technology and one of the MEMS pioneers as well as leading EDA vendors Cadence and Synopsys.

TimeLabelPresentation Title
Authors
11:0010.8.1INTRODUCTION
Moderator:
Ahmed Jerraya, CEA-LETI, FR
12:30End of session
Lunch Break in Exhibition Area
Sandwich lunch