Date: Thursday 21 March 2013
Time: 11:00 - 12:30
Location / Room: Stendahl

Chair:
Siddharth Garg, University of Waterloo, CA

Co-Chair:
Yiran Chen, University of Pittsburgh, US

The circuit reliability is greatly impacted by its thermal profile and power consumption. This session starts with the power optimization and lifetime enhancements for modern VLSI circuits, followed by thermal analysis and simulation methods of 3D ICs.

Time	Label	Presentation Title Authors
11:00	10.3.1	SUBSTITUTE-AND-SIMPLIFY: A UNIFIED DESIGN PARADIGM FOR APPROXIMATE AND QUALITY CONFIGURABLE CIRCUITS Authors: Swagath Venkataramani, Kaushik Roy and Anand Raghunathan, Purdue University, US Abstract
11:30	10.3.2	ENHANCING MULTICORE RELIABILITY THROUGH WEAR COMPENSATION IN ONLINE ASSIGNMENT AND SCHEDULING Authors: Thidapat Chantem1, Yun Xiang2, X. Sharon Hu3 and Robert P. Dick2 1Utah State University, US; 2University of Michigan, US; 3University of Notre Dame, US Abstract
12:00	10.3.3	NUMANA: A HYBRID NUMERICAL AND ANALYTICAL THERMAL SIMULATOR FOR 3-D ICS Authors: Yu-Min Lee1, Tsung-Heng Wu1, Pei-Yu Huang2 and Chi-Ping Yang1 1National Chiao Tung University, TW; 2Industrial Technology Research Institute, TW Abstract
12:15	10.3.4	EXPLICIT TRANSIENT THERMAL SIMULATION OF LIQUID-COOLED 3D ICS Authors: Alain Fourmigue, Giovanni Beltrame and Gabriela Nicolescu, École Polytechnique de Montréal, CA Abstract
12:30	IP5-1, 793	MITIGATING DARK SILICON PROBLEMS USING SUPERLATTICE-BASED THERMOELECTRIC COOLERS Authors: Francesco Paterna and Sherief Reda, Brown University, US Abstract
12:31	IP5-2, 113	RUN-TIME PROBABILISTIC DETECTION OF MISCALIBRATED THERMAL SENSORS IN MANY-CORE SYSTEMS Authors: Jia Zhao, Shiting (Justin) Lu, Wayne Burleson and Russell Tessier, University of Massachusetts Amherst, US Abstract
12:30		End of session Lunch Break in Ecrins Buffet lunch (Eat early for Smart Cities and Communities Keynote - Room Oisans at 1330; http://www.date-conference.com/conference/session/11.0)