W09 International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS Workshop)
Agenda
| Time | Label | Session |
|---|---|---|
| 08:30 | W09.1 | Introduction Chair: |
| 08:30 | W09.1.1 | Introduction to OPTICS workshop Gabriela Nicolescu1 and Mahdi Nikdast2 1Ecole Polytechnique de Montreal, CA; 2Ecole Polytechnique de Montréal, CA |
| 08:40 | W09.2 | Morning Session on System Design, Architecture, Modelling, and Applications Chair: |
| 08:40 | W09.2.1 | Scalable Optical Interconnects for Computing Systems and the Need for Electro-Optical Integration Antonio La Porta, IBM, Zurich Research Laboratory, CH |
| 09:15 | W09.2.2 | Towards a Vertically Integrated Synthesis Flow for Predictable Design of Wavelength-Routed Optical NoCs Davide Bertozzi, University of Ferrara, IT |
| 09:35 | W09.2.3 | Inter/Intra-Chip Optical Networks: Opportunities and Challenges Jiang Xu, Hong Kong University of Science and Technology, CN |
| 09:55 | W09.2.4 | A Force-Directed Placement Algorithm for 3D Optical Networks-on-Chip Anja von Beuningen and Ulf Schlichtmann, Technische Universität München, DE |
| 10:15 | W09.2.5 | System-Level Design Space Exploration for SoCs Integrating Optical Networks on Chip Fabiano Hessel, Pontifícia Universidade Católica do Rio Grande do Sul, BR |
| 10:35 | W09.2.6 | Coffee break |
| 11:00 | W09.2.7 | Meet in the Middle: Leveraging Optical Interconnection Opportunities in Chip Multi Processors Sandro Bartolini, Università di Siena, IT |
| 11:20 | W09.2.8 | Electronic vs Photonic NoCs: Should They Compete or Collaborate? Josè Flich, Universidad Politecnica de Valencia, ES |
| 11:40 | W09.2.9 | Bandwidth Requirements in Manycore Architectures: What Can 3D Bring? Olivier Sentieys, INRIA - University of Rennes 1, FR |
| 12:00 | W09.2.10 | Lunch |
| 13:00 | W09.3 | Afternoon Session on Silicon Photonics Devices, Circuits, and Challenges Chair: |
| 13:00 | W09.3.1 | Building a Scalable Design Environment for Silicon Photonics through PDKs John Ferguson, Mentor Graphics Corp, US |
| 13:35 | W09.3.2 | Recent Development of Si-Photonics in 300mm Fab Sebastien Cremer, STMicroelectronics, FR |
| 13:55 | W09.3.3 | Silicon Photonics for Interposer Yvain Thonnart, CEA, LETI, MINATEC, FR |
| 14:15 | W09.3.4 | Thermal Management of Optical Interconnects Yaoyao Ye, Huawei Technologies Co. Ltd., CN |
| 14:35 | W09.3.5 | Coffee break |
| 15:00 | W09.3.6 | Parametric Exploration of Vertical Tapered Coupler for 3D Optical Interconnection Romain Schuster1, Alberto Parini2 and Gaetano Bellanca2 1Telecom Bretagne, Campus Brest, FR; 2University of Ferrara, IT |
| 15:20 | W09.3.7 | The Last Mile? Remaining Challenges in Optical Interconnect Ian O'Connor, Lyon Institute of Nanotechnology, FR |
| 15:30 | W09.4 | Panel Moderator: |
| Panelists: Panelists: John Ferguson1, Antonio La Porta2, Gabriela Nicolescu3, Olivier Sentieys4, Davide Bertozzi5 and Jiang Xu6 1Mentor Graphics Corp, US; 2IBM, Zurich Research Laboratory, CH; 3Ecole Polytechnique de Montreal, CA; 4INRIA - University of Rennes 1, FR; 5University of Ferrara, IT; 6Hong Kong University of Science and Technology, CN | ||
| 16:20 | W09.5 | Concluding Remarks and Closing Session Chair: |
| 16:20 | W09.5.1 | Concluding remarks Sébastien Le Beux, Lyon Institute of Nanotechnology, Ecole Centrale de Lyon, FR |
| 16:30 | W09.5.2 | Closing |
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