3.1 Executive Panel - Extending Moore's Law & Heterogeneous Integration

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Date: Tuesday 10 March 2015
Time: 14:30 - 16:00
Location / Room: Salle Oisans

Organiser:
Yervant Zorian, Fellow & Chief Architect, Synopsys, US

Systemic scaling in today's new applications is dramatically impacting the semiconductor industry. As a result, certain applications are moving to new advanced semiconductor nodes and others are adopting heterogeneous integration using multi-die modules. In addition to the technical challenges in each case, these solutions significantly affect the dependency between eco-system players necessitating smooth interdependency between them. The executives in this session will discuss the solutions in the semiconductor industry and their impact on the eco system players.

Panelists:

  • Antun Domic, Synopsys, US
  • Rudy Lauwereins, IMEC, BE
  • Didier Tettart, TSMC Europe, NL
16:00End of session
Coffee Break in Exhibition Area

Coffee Break in Exhibition Area

On all conference days (Tuesday to Thursday), coffee and tea will be served during the coffee breaks at the below-mentioned times in the exhibition area.

Lunch Break

On Tuesday and Wednesday, lunch boxes will be served in front of the session room Salle Oisans and in the exhibition area for fully registered delegates (a voucher will be given upon registration on-site). On Thursday, lunch will be served in Room Les Ecrins (for fully registered conference delegates only).

Tuesday, March 10, 2015

Coffee Break 10:30 - 11:30

Lunch Break 13:00 - 14:30; Keynote session from 13:20 - 14:20 (Room Oisans) sponsored by Mentor Graphics

Coffee Break 16:00 - 17:00

Wednesday, March 11, 2015

Coffee Break 10:00 - 11:00

Lunch Break 12:30 - 14:30, Keynote lectures from 12:50 - 14:20 (Room Oisans)

Coffee Break 16:00 - 17:00

Thursday, March 12, 2015

Coffee Break 10:00 - 11:00

Lunch Break 12:30 - 14:00, Keynote lecture from 13:20 - 13:50

Coffee Break 15:30 - 16:00