10.8 PANEL: Will 3D-IC Remain a Technology of the Future… Even in the Future?

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Date: Thursday 21 March 2013
Time: 11:00 - 12:30
Location / Room: Lesdigiueres (Exhibition Theatre)

Organiser:
Marco Casale-Rossi, Synopsys, US

Chair:
Giovanni De Micheli, EPFL, CH

Co-Chair:
Marco Casale-Rossi, Synopsys, US

If asked "who needs faster planes?" the vast majority of the 2.75 billion airline passengers (source: IATA 2011) would say that they do need faster planes, and that they need them right now. Still, the commercial aircrafts cruising speed has remained the same - 800 km/hour - over the last 50+ years, and after the sad end of the Concorde project, neither Airbus nor Boeing are seriously working on the topic. Along the same lines, when asked "who needs 3D-IC?", most IC designers say that they desperately need 3D-IC to keep advancing electronic products performance, whilst addressing the needs of higher bandwidth, lower cost, heterogeneous integration, and power constraints. Still, 3D-IC continues to be the technology of the future. What are the road blocks towards 3D-IC adoption? Is it process technology, foundry or OSAT commercial offering, or EDA, or the business economics that is holding 3D-IC on the ground? In the introductory presentation of this panel session, LETI Patrick Leduc will illustrate the state-of-the-art of commercial, mainstream 3D-IC. EPFL Professor Giovanni de Micheli will moderate an industry and research panel, to understand what are the key factors preventing 3D-IC from becoming the technology of today.

Panelists:

  • Patrick Blouet, ST-Ericsson, FR
  • Brendan Farley, Xilinx, IE
  • Anna Fontanelli, Monozukuri, IT
  • Patrick Leduc, LETI, FR
  • Dragomir Milojevic, IMEC, BE
  • Steve Smith, Synopsys, US
12:30End of session
Lunch Break in Ecrins
Buffet lunch (Eat early for Smart Cities and Communities Keynote - Room Oisans at 1330; http://www.date-conference.com/conference/session/11.0)