Practical Substrate Design Considering Symmetrical and Shielding Routes
Hao-Yu Chi1,a, Simon Yi-Hung Chen2,b, Hung-Ming Chen1,c, Chien-Nan Liu1,d, Yun-Chih Kuo2,e, Ya-Hsin Chang2,f and Kuan-Hsien Ho2,g
1Institute of Electronics, National Yang Ming Chiao Tung University, Taiwan
alogger1006.ee07g@nctu.edu.tw
bSimonYH.Chen@mediatek.com
chmchen@mail.nctu.edu.tw
djimmyliu@nctu.edu.tw
2Mediatek Inc., Taiwan
eericyc.kuo@mediatek.com
fcindy.chang@mediatek.com
groy.ho@mediatek.com
ABSTRACT
In modern package design, the flip-chip package has become mainstream because of the benefit of its high I/O pins. However, the package design is still done manually in the industry. The lack of automation tools makes the package design cycle longer due to complex routing constraints, and the frequent modification requests. In this work, we propose yet another routing framework for substrate routing. Compared with previous works, our routing algorithm generates a feasible routing solution in a few seconds for industrial design and considers important symmetry and shielding constraints that have not been handled before. Benefiting from the efficiency of our routing algorithm, the designer can get the result immediately and accommodate some modifications to reduce the cost. The experimental result shows that the routing result generated from our router is in good quality, very close to the manual design.
Keywords: Substrate Routing, Area Routing, Symmetry, Shielding.
