Fully Integrated Photonic Circuits On Silicon By Means of Iii-V/Silicon Bonding
Florian Denis-le Coarer
SCINTIL Photonics, US
ABSTRACT
This presentation introduces a new platform integrating heterogeneous III-V/silicon gain devices at the backside of silicon-on-insulator wafers. The fabrication relies on commercial silicon photonic processes. This platform enables fully photonic integrated circuits comprising lasers, modulators, passives and photodetectors, that can be tested at the wafer level.
