A TSV Noise-Aware 3-D Placer
Yu-Min Leea, Chun Chenb, JiaXing Songc and Kuan-Te Pand
National Chiao Tung University, Taiwan.
In this work, a three-dimensional partitioning-based force-directed placer is developed to minimize coupling noise between through silicon vias (TSVs) in three-dimensional integrated circuits. TSV decoupling force is introduced and determined by the TSV coupling noise to separate TSVs with strong coupling noise. The experimental results indicate that TSV coupling noise can be effectively reduced by 36.3% on average with only 6.0% wirelength overhead. Besides, the developed 3-D placer shows great performance in wirelength that is competitive to a state-of-the-art 3-D placer.
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