Silicon Proof of the Intelligent Analog IP Design Flow for Flexible Automotive Components
T. Reicha, H. D. B. Prautschb, U. Eichlerc and R. Buhld
Fraunhofer Institute for Integrated Circuits, Design Automation Division, Dresden, Germany.
In this brief paper we present the successful silicon validation of the Intelligent Analog IP (IIP) design flow applied to the design of a SMART sensor IC for automotive requirements. Using a library of reconfigurable and robust analog IP we fast create parameterized cells up to high complexity levels including the corresponding layouts. This allows us (1) to overcome time-consuming handcrafted analog re-design cycles, (2) to include the effects of layout parasitics into the optimization loop, and thus (3) to fast achieve different specifications even for multiple technologies. We show that the IIP design flow leads to a strong improvement of design efficiency, silicon performance, and yield.
Keywords: Intelligent IP, Reuse, Design flow, Post-layout, Optimization, Yield.
Full Text (PDF)