Technical Programme Committee 2012

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Topic: T1 Test for Defects, Variability, and Reliability

Identification, characterization and modeling of defects, faults and degradation mechanisms; Defect based fault analysis, Simulation and ATPG of defect based faults; Reliability analysis and modeling techniques, FMEA and Physics of failure; Test for noise and uncertainty; Design for Reliability and Design for Variability and their impact on test; Test and reliability of redundant systems; Test and reliability issues in the presence of leakage; Challenges of ultra low-power design on test and reliability; Modeling and test techniques for physical sources of errors such as process, voltage and temperature variations; Error-resilient nano design systems.

Chair: Sandip Kundu, University of Massachusetts, US, Contact

Co-Chair: Bram Kruseman, NXP Semiconductors, NL, Contact


  • Robert Aitken, ARM, US, Contact
  • kjleeatmail [dot] ncku [dot] edu [dot] tw, Contact
  • , Contact
  • Markus Rudack, Intel Mobile Communications GmbH, DE, Contact
  • jaume [dot] seguraatuib [dot] es, Contact
  • Xiaoqing Wen, Kyushu Institute of Technology, JP, Contact