Test techniques for mixed-signal, RF and multi-GHz electronics; test techniques for embedded MEMS/bioMEMS/MOEMS sensors and actuators; assembly engineering for SiP/SoC/SoP/PoP; Failure modelling and analysis techniques; defect characterization and fault modelling; fault simulation and test generation algorithms; DfT/DfM/DfY/DfR (DfX) techniques; BIST; test coverage metrics and statistical modelling; effective defect screening techniques; diagnosis and self-repair.