Modeling, characterization and analysis of on and off chip interconnects and packaging. Coupling effects and guided waves on interconnects. Modeling and analysis of noise due to electromagnetic interaction on signal, power/ground and substrate. Specific topics are model order reduction for interconnects and passive systems; electrostatic discharge (ESD); macromodels for variability-aware timing analysis; 3D interconnects (or interconnect models for 3D chips); interconnect parameter extraction and circuit model generation; signal integrity analysis; power and ground network analysis; thermal modeling and analysis; modeling for manufacturability, reliability, and robustness; electromagnetic emission, susceptibility and compatibility; electrical overstress