Design and Optimization of Heterogeneous Manycore Systems Enabled by Emerging Interconnect Technologies: Promises and Challenges
Biresh Kumar Joardar1,a, Ryan Gary Kim2, Janardhan Rao Doppa1,b and Partha Pratim Pande1,c
1School of EECS, Washington State University Pullman, WA 99164, U.S.A.
abiresh.joardar@wsu.edu
bjana.doppa@wsu.edu
cpande@wsu.edu
2Deoartment of ECE Colorado State University Fort Collins, CO, 80523, U.S.A.
Ryan.G.Kim@colostate.edu
ABSTRACT
Due to the growing needs of Big Data applications (e.g., deep learning, graph analytics, and scientific computing) and the ending of Moor's Law, there is a great need for low-cost, highperformance, energy-efficient, and small form-factor manycore systems. With more stringent design objectives, application specialization, and more cores on a single chip, design-time optimization becomes more complex. Moreover, with the advent of emerging interconnect technologies like 3D integration, the design optimization process has become more challenging. This increases the need for a holistically optimized design process that makes design decisions across multiple layers of the system, e.g., memory, compute, interconnect technology, and network infrastructure. In this paper, we present various challenges of designing heterogeneous manycore architectures using 3D integration and viable optimization techniques to solve them.
