Smart Thermal Management for Heterogeneous Multicores
Jörg Henkela, Heba Khdrb and Martin Rappc
Chair for Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Germany
ahenkel@kit.edu
bheba.khdr@kit.edu
cmartin.rapp@kit.edu
ABSTRACT
Heterogeneous multicores have attracted a major focus in recent years, as they provide many possibilities for performance improvements. However, due to the discontinuation of Dennard scaling, on-chip power densities are continuously increasing along with technology scaling, and hence on-chip temperatures are elevated. Therefore, several thermal management techniques have emerged to keep the temperature of the chip within safe limits. These techniques, however, lead to performance losses which ultimately erase a big portion of the expected performance gains from the heterogeneous multicores. Thus, it is indispensable to deploy thermal management techniques that are able to make efficient decisions which satisfy temperature constraints while at the same time maximizing the performance. This paper presents smart thermal management techniques for heterogeneous multicores that exploit relevant information about several heterogeneity parameters at the chip level and at the application level to increase thermal efficiency1. Compared to the state of the art, the presented techniques are able to obtain significant performance improvements under the same thermal constraint. This paper is part of the DATE 2019 special session on "Smart Resource Management and Design Space Exploration for Heterogeneous Processors". The other two papers of this special session are [1] and [2].
Keywords: Thermal Management, Thermal Efficiency, Power Density, Heterogeneous Multicores, Performance Optimization
