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doi: 10.7873/DATE.2015.0276
Mixed Wire and Surface-wave Communication Fabrics for Decentralized On-Chip Multicasting
Ammar Karkar1,2,a,b, Kin-Fai Tong3, Terrence Mak4 and Alex Yakovlev1,c
1School of Electrical and Electronic Engineering, Newcastle University, UK.
aa.j.m.karkar@newcastle.ac.uk
bammar.karkar@uokufa.edu.iq calex.yakovlev@newcastle.ac.uk
2IT Research Centre, University of Kufa, Iraq
3Department of Electrical and Electronic Engineering, UCL, London, UK.
K.tong@ucl.ac.uk
4Department of Computer Science and Engineering, The Chinese University of Hong Kong, Hong Kong.
stmak@cse.cuhk.edu.hk
ABSTRACT
Network-on-chip (NoC) has emerged to tackle different on-chip challenges and has satisfied different demands in terms of high performance, economical and reliable interconnect implementation. However, a merely metal-based interconnect reaches performance bound with the relentless technology scaling. Especially, it displayed a bottleneck to meet the communication bandwidth demand for multicasting. This paper proposes a novel hybrid architecture, which improves the on-chip communication bandwidth significantly using mixed wires and surface wave interconnects (SWI) fabrics. In particular, the bandwidth of multicasting can be drastically improved. We introduce a decentralized arbitration method to fully utilize the slack-time scheduling with deadlock-free flow control. Evaluation results, based on a cycleaccurate and hardware-based simulation, demonstrate the effectiveness of the proposed architecture and methods. Compared to a wire-based NoC, the mixed fabric approach can achieve an improvement in power reduction and communication speed up to 63% and 12X, respectively. These results are achieved with almost negligible hardware overheads. This new paradigm efficiently addresses the emerged challenges for on-chip communications.
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