Date: Tuesday 26 March 2019
Time: 11:30 - 13:00
Location / Room: Room 3

Organisers:
Jim Huang, Hewlett Packard Labs, US
Mehdi Tahoori, Karlsruhe Institute of Technology (KIT), DE

Chair:
Jamil Kawa, Synopsys, US

Flexible electronics is an emerging and fast growing field which can be used in many demanding and emerging application domains such as wearables, smart sensors, and Internet of Things (IoT). There are several technologies, processes and paradigms which can be used to design and fabricate flexible circuits. Unlike traditional computing and electronics domain which is mostly driven by performance characteristics, flexible electronics are mainly associated with low fabrication costs (as they are used even in consumer market) and low energy consumption (as they could be used in energy-harvested systems). While the main advances in this field is mainly focused on fabrication and process aspects, the design and in particular design automation flow, had limited exposure. The purpose of this special session is to bring to the attention of design automation community on some of the key advances in the field of flexible electronics as well as some of the design (automation) aspects, which can hopefully inspire some further attention by design automation community to this fast-growing field.

Time	Label	Presentation Title Authors
11:30	2.3.1	DUAL-GATE SELF-ALIGNED A-INGAZNO TRANSISTOR MODEL FOR FLEXIBLE CIRCUIT APPLICATIONS Speaker: Kris Myny, imec, BE Authors: Florian De Roose, Hikmet Çeliker, Jan Genoe, Wim Dehaene and Kris Myny, imec, BE Abstract This work elaborates on an amorphous Indium- Gallium-Zinc Oxide thin-film transistor model for a dual-gate self-aligned transistor configuration, enabling the design and realization of complex integrated circuits. The model originates from a mobility-enhanced transistor behavior model, whereby the additional backgate impacts key parameters, such as threshold voltage, mobility and subthreshold slope. The model has been validated for the full design flow and compared to measurement results, from single transistors, to inverters, ring oscillators and RFID transponder chips. Download Paper (PDF; Only available from the DATE venue WiFi)
11:52	2.3.2	PREDICTIVE MODELING AND DESIGN AUTOMATION OF INORGANIC PRINTED ELECTRONICS Speaker: Jasmin Aghassi-Hagmann, Offenburg University of Applied Sciences / Institute of Nanotechnology at Karlsruhe Institute of Technology, DE Authors: Farhan Rasheed1, Michael Hefenbrock1, Rajendra Bishnoi1, Michael Beigl1, Jasmin Aghassi-Hagmann2 and Mehdi B. Tahoori1 1Karlsruhe Institute of Technology (KIT), DE; 2Offenburg University of Applied Sciences / Institute of Nanotechnology at Karlsruhe Institute of Technology), DE Abstract Printed Electronics is perceived to have a major impact in the fields of smart sensors, Internet of Things and wearables. Especially low power printed technologies such as electrolyte gated field effect transistors (EGFETs) using solution- processed inorganic materials and inkjet printing are very promising in such application domains. In this paper, we discuss a modeling approach to describe the variations of printed devices. Incorporating these models and design flows into our previously developed printed design system allows for robust circuit design. Additionally, we propose a reliability-aware routing solution for printed electronics technology based on the technology constraints in printing crossovers. The proposed methodology was validated on multiple benchmark circuits and can be easily integrated with the design automation tools-set. Download Paper (PDF; Only available from the DATE venue WiFi)
12:14	2.3.3	PROCESS DESIGN KIT AND DESIGN AUTOMATION FOR FLEXIBLE HYBRID ELECTRONICS Speaker: Tsung-Ching Jim Huang, Hewlett-Packard Labs, US Authors: Tsung-Ching Jim Huang1, Ting Lei2, Leilai Shao3, Sridhar Sivapurapu4, Madhavan Swaminathan4, Sicheng Li5, Zhenan Bao2, Kwang-Ting Cheng3 and Raymond Beausoleil5 1Hewlett-Packard Labs, US; 2Department of Chemical Engineering, Stanford University, US; 3Department of Electrical and Computer Engineering, University of California, US; 4School of Electrical and Computer Engineering, Georgia Institute of Technology, US; 5Hewlett Packard Labs, Palo Alto, US Abstract High-performance low-cost flexible hybrid electron- ics (FHE) are desirable for internet of things (IoT). Carbon- nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mo- bility (25cm2/V.s), superior mechanical flexibility/stretchability, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers and sense amplifiers, can be printed and integrated with thinned (<50μm) silicon chips on soft, thin, and flexible substrates for appealing product designs and form factors. Here we report: 1) process design kit (PDK) to enable FHE design automation, from device modeling to physical verification, and 2) open-source and solution-process proven intellectual property (IP) blocks, including Pseudo-CMOS digital logic and analog amplifiers on flexible substrates, as shown in Figure 1. The proposed FHE-PDK and circuit design IP are fully compatible with silicon design EDA tools, and can be readily used for co-design with both CNT-TFT circuits and silicon chips. Download Paper (PDF; Only available from the DATE venue WiFi)
12:36	2.3.4	CIRCUIT DESIGN AND DESIGN AUTOMATION FOR PRINTED ELECTRONICS Speaker: Eugenio Cantatore, Eindhoven University of Technology, NL Authors: M. Fattori1, J.A. Fijn1, L. Hu1, Eugenio Cantatore1, Fabrizion Torricelli2 and Micael Charbonneau3 1Eindhoven University of Technology, NL; 2University of Brescia, IT; 3CEA-LITEN, FR Abstract A Process Design Kit (PDK) for gravure-printed Organic Thin-Film Transistor (OTFT) technology is presented in this paper. The transistor model developed in the PDK enables an accurate prediction of static, dynamic and noise performance of complex organic circuits. The developed Electronic Design Automation (EDA) tools exploit an adaptive strategy to improve the versatility of the PDK in relation to the advancements of the manufacturing process. The design and experimental characterization of a Charge Sensitive Amplifier is used to demonstrate the effectiveness of the PDK. The availability of a versatile and accurate Process Design Kit is expected to enable a reliable design process for complex circuits based on an organic printed technology. Download Paper (PDF; Only available from the DATE venue WiFi)
13:00		End of session Lunch Break in Lunch Area Coffee Breaks in the Exhibition Area On all conference days (Tuesday to Thursday), coffee and tea will be served during the coffee breaks at the below-mentioned times in the exhibition area. Lunch Breaks (Lunch Area) On all conference days (Tuesday to Thursday), a seated lunch (lunch buffet) will be offered in the Lunch Area to fully registered conference delegates only. There will be badge control at the entrance to the lunch break area. Tuesday, March 26, 2019 Coffee Break 10:30 - 11:30 Lunch Break 13:00 - 14:30 Keynote Lecture "Leonardo da Vinci, Humanism and Engineering between Florence and Milan" by Claudio Giorgione in room 1 13:50 - 14:20 Coffee Break 16:00 - 17:00 Wednesday, March 27, 2019 Coffee Break 10:00 - 11:00 Lunch Break 12:30 - 14:30 Keynote Lecture "Heterogeneous, High Scale Computing in the Era of Intelligent, Cloud-Connected" by David Pellerin, Amazon, US in room 1 13:50 - 14:20 Coffee Break 16:00 - 17:00 Thursday, March 28, 2019 Coffee Break 10:00 - 11:00 University Booth Best Demo Award Presentation at the University Booth 10:30 Lunch Break 12:30 - 14:00 Keynote Lecture "A Fundamental Look at Models and Intelligence" by Edward A. Lee, University of California, Berkeley, US in room 1 13:20 - 13:50 Coffee Break 15:30 - 16:00