Date: Wednesday 29 March 2017
Time: 14:30 - 16:00
Location / Room: 5A
Chair:
Jose Pineda De Gyvez, NXP, NL
Co-Chair:
Vikas Chandra, ARM, US
This session discusses new trends and solutions to model and mitigate resiliency challenges for advanced memory technologies. The first paper discusses unequal protection for more efficient memory resiliency. The second paper analyzes the aging impact on different memory components. Finally, the third paper proposes mitigation schemes for memory peripheral circuitry.
| Time | Label | Presentation Title Authors |
|---|---|---|
| 14:30 | 7.6.1 | (Best Paper Award Candidate) MVP ECC : MANUFACTURING PROCESS VARIATION AWARE UNEQUAL PROTECTION ECC FOR MEMORY RELIABILITY Speaker: Joon-Sung Yang, Sungkyunkwan University, KR Authors: Seungyeob Lee and Joon-Sung Yang, Sungkyunkwan University, KR Abstract With a development of process technology, a memory density has been increased. However, a smaller feature size makes the memory susceptible to soft errors. For reliability enhancement, ECC with single bit error correction and double bit error detection is widely used. As multiple bit cell upset become dominant, there is a need for stronger ECC. ECC such as RS or BCH code requires significantly large overhead and longer latency. To overcome the problem, this paper introduces an unequal protection ECC assigning stronger level of protection to weak memory cells and normal level to normal cells. Information from manufacturing characterization test is utilized to identify weak memory cells with low design margins. Instead of equally treating all memory cells, the proposed ECC focuses more on the weak cells since they are more susceptible to soft errors. Compared to conventional ECCs, experimental results show that the proposed ECC considerably enhances memory reliability with the same code length. Download Paper (PDF; Only available from the DATE venue WiFi) |
| 15:00 | 7.6.2 | ANALYZING THE EFFECTS OF PERIPHERAL CIRCUIT AGING OF EMBEDDED SRAM ARCHITECTURES Speaker: Josef Kinseher, Intel Deutschland, DE Authors: Josef Kinseher1, Leonhard Heiß1 and Ilia Polian2 1Intel Deutschland, DE; 2University of Passau, DE Abstract Modern System-on-Chips rely heavily on the performance of their embedded memories which are also most susceptible to the increasing reliability challenges of today's nanoscale technology nodes. However, in contrast to memory core-cells, the effects of transistor aging inside the peripheral logic of SRAM architectures have received little attention. This study works out how BTI and HCI induced wear-out of the peripheral SRAM circuitry impacts various performance metrics of an industrially used memory library. We show that the degradation of the peripheral logic is the dominant driver for access speed loss while it tends to slightly lower memory read margin and lead to minor improvements of write margin. We furthermore show that in terms of access margin the degradation of SRAM control circuitry counteracts aging effects inside core-cells and sense amplifiers. Surprisingly, wear-out of peripheral circuitry can even improve access margin in case when the relative magnitude of PBTI is much lower compared with NBTI. Based on the example of an embedded memory library, this study further underlines the importance to analyze aging mechanisms at system level rather than for its individual interacting sub-circuits. Download Paper (PDF; Only available from the DATE venue WiFi) |
| 15:30 | 7.6.3 | MITIGATION OF SENSE AMPLIFIER DEGRADATION USING INPUT SWITCHING Speaker: Daniel Kraak, Delft University of Technology, NL Authors: Daniel Kraak1, Innocent Agbo1, Mottaqiallah Taouil1, Said Hamdioui1, Pieter Weckx2, Stefan Cosemans2, Francky Catthoor2 and Wim Dehaene3 1Delft University of Technology, NL; 2imec, BE; 3KU Leuven, ESAT, BE Abstract To compensate for time-zero (due to process variation) and time-dependent (due to e.g. Bias Temperature Instability) variability, designers usually add design margins. Due to technology scaling, these variabilities become worse, leading to the need for bigger design margins. Typically, only worst-case scenarios are considered, which will not present the actual workload of the targeted application. Alternatively, mitigation schemes can be used to counteract the variability. This paper presents a run-time design-for-reliability scheme for memory Sense Amplifiers (SAs); SAs are an integral part of any memory system and are very critical for high performance. The proposed scheme mitigates the impact of time-dependent variability due to aging by using an on-line control circuit to create a balanced workload. The simulation results show that the proposed scheme can reduce the most critical figures-of-merit, namely the offset voltage shift and the sensing delay of the SA with up to ~40% and ~10%, respectively, depending on the stress conditions (temperature, voltage, workload). Download Paper (PDF; Only available from the DATE venue WiFi) |
| 16:00 | IP3-15, 16 | A BRIDGING FAULT MODEL FOR LINE COVERAGE IN THE PRESENCE OF UNDETECTED TRANSITION FAULTS Speaker and Author: Irith Pomeranz, Purdue University, US Abstract A variety of fault models have been defined to capture the behaviors of commonly occurring defects and ensure a high quality of testing. When several fault models are used for test generation, it is advantageous if the existence of an undetectable fault in one model does not imply that a fault in the same component but from a different model is also undetectable. This allows a test set to cover the circuit more thoroughly when additional fault models are used. This paper studies the possibility of defining such fault models by considering transition faults as the first fault model, and bridging faults as the second fault model. The bridging faults are defined to cover lines for which transition faults are not detected. A test compaction procedure is developed to demonstrate the bridging fault coverage that can be achieved, and the effect on the number of tests. Download Paper (PDF; Only available from the DATE venue WiFi) |
| 16:00 | End of session Coffee Break in Exhibition Area On all conference days (Tuesday to Thursday), coffee and tea will be served during the coffee breaks at the below-mentioned times in the exhibition area. Tuesday, March 28, 2017
Wednesday, March 29, 2017
Thursday, March 30, 2017
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