Technical Programme Committee 2012

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Topic: T3 Test for Mixed-Signal, Analog, RF, MEMS

Test techniques for mixed-signal, RF and multi-GHz electronics; test techniques for embedded MEMS/bioMEMS/MOEMS sensors and actuators; assembly engineering for SiP/SoC/SoP/PoP; Failure modeling and analysis techniques; defect characterization and fault modeling; fault simulation and test generation algorithms; DfT/DfM/DfY/DfR (DfX) techniques; BIST; test coverage metrics and statistical modeling; effective defect screening techniques; diagnosis and self-repair.

Chair: Hans Kerkhoff, University of Twente / CTIT, NL, Contact

Co-Chair: Tracy021 Tracy021, 123, BH, Contact


  • azaisatlirmm [dot] fr, Contact
  • Sebastian Sattler, University Erlangen-Nuermberg, DE, Contact
  • haralampos [dot] stratigopoulosatlip6 [dot] fr, Contact